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Unicomp AX9100 Boosts Precision in Electronic Component Xray Inspection

2026/06/08
최신 회사 블로그 Unicomp AX9100 Boosts Precision in Electronic Component Xray Inspection
Unicomp AX9100 Boosts Precision in Electronic Component Xray Inspection
Unicomp AX9100 130KV Closed-Source X-Ray Inspection System

In modern industrial production where extreme precision and reliability are paramount, particularly in electronic component manufacturing, non-destructive testing of internal product structures has become critically important. From microscopic solder joints to complex integrated circuits, any potential defect could lead to significant performance degradation or complete failure. The Unicomp AX9100 130KV closed-source X-ray inspection system addresses this challenge with exceptional imaging quality, operational flexibility, and broad application capabilities, providing robust technical support for quality control of precision components including BGAs, PCBAs, diodes, and semiconductors.

Core Technology and System Specifications

The Unicomp AX9100 features an advanced 130KV closed-source X-ray tube paired with a high-performance flat panel detector (FPD), capable of generating high-resolution, high-definition real-time X-ray images. Key technical specifications include:

System Parameters
  • Dimensions: 1350mm (L) × 1250mm (W) × 1700mm (H) - Compact design for easy integration into production lines
  • Weight: 1900kg - Robust construction ensures operational stability
  • Power Requirements: 220VAC/50Hz - Standard industrial voltage for easy connectivity
  • Power Consumption: 1.6kW - Excellent energy efficiency aligned with green manufacturing principles
X-Ray System Capabilities
  • X-Ray Tube Type: Closed-source design ensures operational safety and extended service life
  • Maximum Voltage: 130kV - Sufficient penetration for most electronic components
  • Maximum Power: 40W - Precise X-ray output control minimizes material impact
  • Focal Spot Size: 7μm - Exceptional imaging detail for revealing microscopic defects
  • Image Enhancement: FPD (flat panel detector) offers superior sensitivity, faster response, and better spatial resolution than traditional image intensifiers
  • Display: 22-inch LCD HD monitor provides wide viewing area and detailed image presentation
  • Maximum System Magnification: 1600× - Enables detailed observation from macro to micro levels
Inspection Area and Safety
  • Maximum Sample Size: Φ570mm - Accommodates various sample dimensions
  • Maximum Inspection Area: 450mm × 450mm - Covers most standard PCB and component sizes
  • X-Ray Leakage: <1μSv/h - Significantly below international safety standards
Key Features of the Unicomp AX9100

The AX9100 incorporates multiple innovative features that distinguish it from comparable systems:

  • High-Energy X-Ray with Microfocus Technology: 90-130KV energy range combined with 7μm microfocus enables penetration of thicker materials while capturing minute structural details like microvoids, cracks, or internal shorts.
  • High-Performance FPD Detector: High-speed, multi-megapixel FPD delivers superior spatial resolution and grayscale accuracy, crucial for identifying microscopic defects.
  • Advanced Magnification & Real-Time Imaging: Up to 1000× magnification with high-definition real-time display allows immediate observation of internal structures and rapid decision-making.
  • Intuitive Operation: One-touch operation simplifies workflow while 2.5D imaging provides enhanced three-dimensional visualization for better structural understanding.
  • Smart Inspection Workflow: Offline programming capability enables pre-configuration of inspection routines during non-production hours, while navigation mode quickly directs operators to potential defect areas.
  • Flexible Motion Control: 7-axis coordinated movement with 70° tilt capability allows comprehensive multi-angle scanning, particularly valuable for complex structures.
Broad Application Spectrum

The AX9100's versatility and precision make it invaluable across multiple high-tech manufacturing sectors:

Industry Applications
Surface Mount Technology (SMT) & Packaging BGA, CSP, Flip Chip, LED solder joint inspection and internal structure verification
Semiconductor & Electronic Components Wafer inspection, packaged component analysis, diode evaluation for internal defects and metallization issues
New Energy & Battery Battery internal structure examination, electrode connection analysis, separator condition assessment
Automotive Electronics & Photovoltaics Automotive component reliability testing, PV cell and module internal connection inspection
Precision Manufacturing Die-cast aluminum, injection-molded plastic parts for internal voids, inclusions, or cracks
Specialty Industries Ceramics, medical devices requiring customized inspection solutions
Comprehensive Service Commitment
  • Project analysis and customized solution development
  • Complimentary sample testing prior to purchase
  • Tailored inspection protocols based on industry expertise
  • Custom fixture design for optimal sample positioning
  • Logistics and delivery tracking services
  • One-year warranty with lifetime technical support
  • 24-hour response guarantee for all inquiries
Frequently Asked Questions
How is the equipment packaged for shipping?

All X-ray inspection systems are secured in internationally compliant reinforced wooden crates to ensure safe transportation.

What warranty and support services are provided?

The system includes a one-year comprehensive warranty covering all components, complemented by lifetime technical assistance including instructional video resources.

Is training available for visiting customers?

Factory visitors receive complimentary operational and maintenance training to facilitate rapid proficiency.

The Unicomp AX9100 130KV closed-source X-ray inspection system represents a critical quality assurance tool for precision electronics manufacturing. Its advanced technology not only enhances inspection accuracy and efficiency but significantly contributes to product reliability and market competitiveness.