bga inspection equipment
"
자동 전자공학 단위를 위한 닫힌 관 SMT 엑스레이 장비 AX8200 8W
Applying 5micro closed tube AX8200 X-ray for Automotive Electronics Modules quality defects control Other Special Industries. Item Definition Specs System Parameters Size 1080(L)X1180(W)X1730(H)mm Weight 1150kg Power 220AC/50HZ Power Consumption 0.8KW X-Ray Tube Type Closed Max.Voltage 90kv/100kv Max.Power 8W Spot Size 5μm X-Ray System Intensifier 4"Image Intensifier Monitor 22"LCD System Magnification 600X Detection Region Max.Loading Size 510mm x 420mm Max.Inspection Area
BGA, CSP, LED & 반도체를 위한 CX3000 벤치 탑 전자공학 엑스레이 기계
CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor X ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. X ray Inspecting Features: (1) Coverage of process defects up to 97%.
CSP 5KW 리튬 배터리 정밀검사 기계 AX8800 0.2mA
Cabinet Lithium Battery Automatic X-ray Inspection Machine AX8800 Applications: ● Lithium battery pole piece solder joint defect detection, ● Lithium battery batteries coiling case detection, ● BGA , CSP , LED , Flip Chip , Semiconductor, ● Battery Industry , Small Metal Casting, ● Electronic Connector Module, ● Aerospace Components , Photovoltaic Industry , ● Other Special Industries. Aftersales service: Ø A professional service team Ø Country-wide network Ø 24/7 hotline Ø
FPD 검출기 1kW 90KV EMS 점검 X- 선 장비
Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Features • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • Multi-function DXI image processing system, CNC programmable detection • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification • Multi-function workstation with
AX8500 SMT/EMS 엑스레이 기계, 엑스레이 검사 장비는 관 유형을 닫았습니다
AX8500 Metal X Ray Machine for Micro BGA / chip on chop analysis Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm Tilt Detection Angle 60° X-Ray System Tube Type Closed Voltage/Current 100kv/200μA Focal Spot Size 5μm FPD Detector FPD Physical & Image Processing Parameters Length x Width x Height 1250 x 1300 x 1900 mm Weight 1500 kg Power 2kW System Magnification 500 x Leakage
유니컴 엑스레이 AX8300 플러스 반도체 마이크로 포커스 엑스레이 검사 장비
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 2 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel
PCB/BGA 분석을 위한 인라인 Unicomp LX9200 엑스레이 검열제도 높은 정밀도
Inline High-Precision 3D X-Ray Tomography for PCB and BGA Analysis Unicomp LX9200 X-Ray inspection system Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge... Semiconduc
저항 결함을 위한 FDA 90KV 폐관법 X- 선 검출 장비
FDP 90KV X-Ray Machine For Resistance Defects DetectingApplicationsBGA InspectionInspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection EMS Semiconductor Electronics X Ray Machine System for BGA and CSP
태양광 발전 납땜을 위한 BGA 90kV 전자 X- 선 기계
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
