bga x ray inspection system
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유니컴 엑스레이 AX9100vs 다중 모드 3D 마이크로 포커스 엑스레이 분석 검사 시스템
Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Precise detection inspection of tiny defects 2. Multi-mode 3D reconstruction 3. Synchronized 7-axis manipulation with any angle 4. Batch mode positioning inspection 5. Closed tube with maintenance-free X-ray source 6.
유니컴 엑스레이 AX8300VS 다중 모드 3D 마이크로 포커스 엑스레이 분석 검사 시스템
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. precise detection inspection of tiny defects 2. multi-mode 3d reconstruction 3. synchronized 7-axis manipulation with any angle 4. batch mode positing inspection 5. closed tube with maintenance-free x-ray source 6.
정확한 BGA 보이드 검출을 위한 Unicomp AX7900 90KV 2D X선 시스템
Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection Description of BGA X-Ray machine AX7900: Equipped with 90kV / 5μm micro-focus X-ray tube and high-performance FPD detector, AX7900 adopts a multifunctional workstation design. It features standard XY multi-axis motion with optional ±60° tilt. Independent Z-axis movement of X-ray tube and FPD allows flexible adjustment of magnification and FOV. Integrated with target positioning system and professional DXI
고정밀 PTH 스루홀 PCB 조립 X-레이 AX7900 유니콤프 고안정성
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
110kV 밀봉 튜브 고정밀 IC 반도체 부품 엑스레이 장비 AX8300MAX Unicomp 품질 관리
110kV Sealed Tube High Precision IC Semiconductor Component Xray Equipment AX8300MAX Unicomp Quality Control Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual
디지털 방사선 기계 및 X선 기계 Unicomp AX7900 PCB 수리 및 IC/BGA 공 용접 측정 및 테스트
Digital Radiography machine & x ray machine Unicomp AX7900 for pcb repair and IC/BGA ball soldering measurement&testing Description of IC X Ray machine AX7900: It is widely adopted across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics. FEATURES of IC Xray machine AX7900: Large Size Inspection Table
90kV X Ray 기계 고해상도 Unicomp AX7900 5um 튜브와 함께 BGA 접착 전선 곡선 테스트
90kv X ray machine high resolution Unicomp AX7900 with 5um tube for BGA bonding wires curvature testing Description of IC X Ray machine AX7900: It is broadly utilized in industries such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location
자동 무효 감지 높은 모션 정밀 BGA 솔더 조인트 엑스레이 장비 AX8300 Unicomp 품질 관리
Unicomp X-ray Detector AX8300 The AX-8300 is professionally engineered to satisfy high-precision visual inspection requirements for PCBA assemblies.It pioneers the adoption of a customized 110kV micro-focus X-ray source within the industry, acting as an optimal intermediate-grade solution. It delivers balanced penetrating capability, effectively compensating for the insufficient energy of 90kV equipment while avoiding the excessive radiation power of 130kV models.Featuring a
세미콘 칩 안쪽 결점 점검을 위한 고해상도 X-레이 기계 AX8200MAX
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
