bga x ray machine
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CSP LED 탁상용 엑스레이 기계 0.8KW Unicomp AX7900 DXI 시스템
Venous Indwelling needle inside assembly quality inspection by Unicomp AX7900 X-ray machine Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm
100KV 반도체를 위한 CSP LED 엑스레이 기계 닫히는 관 손가락으로 튀김 칩 AX8500
Closed Tube Type AX8500 X Ray Machine for semiconductor Lead frame wiring bonding quality inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
세미콘을 위한 SMT BGA X- 선 검출 장비 플립 침 FPD 검출기 130KV
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image
IGBT 세미콘 납땜을 위한 유니컴프 인라이닝 전자 X- 선 기계 3.5kW
Unicomp Inline Electronics X Ray Machine 3.5kW For IGBT Semicon Soldering Unicomp High Speed Inline 2D X-ray Inspection machine with cutting edge AI Algorithm For IGBT Semicon soldering void checking Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight
IC 세미콘 점검을 위한 5 um 폐관 AX9100 유니컴프 X- 선 기계 FPD 사면도
Unicomp 5μm close tube AX9100 X-ray machine with FPD oblique view for IC Semicon inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
유니콤프 AX9180 180kV 마이크로포커스 전자 X선 장비 FPD 경사형
Unicomp AX9180: 10μm 스폿 크기, 60° 기울기 및 7축 연결을 갖춘 180kV 마이크로초점 X선. 고해상도 FPD는 정밀한 PCB, BGA 및 반도체 검사를 위해 1000X 배율을 제공합니다. 1년 보증 및 오프라인 프로그래밍이 포함됩니다.
CX3000 BGA와 CSP 검사를 위한 탁상용 전자공학 PCB 엑스레이 기계
CX3000 Benchtop Electronics PCBA Unicomp X-ray Detection Equipment Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray Leakage
SMD 케이블 전자공학 엑스레이 기계, Unicomp 엑스레이 발견자 AX8300 1500kg
SMD Cable Electronics Components Unicomp X-ray Detector AX8300 Model AX8300 Max kV/type 110 kV(Option90 kV)/Sealed Max.Electron beam power 25W(Option8W) Focal spot size1 7μm System magnification Up to 1000X Imaging system(Option) Flat Panel Detector Manipulator 8-axis with tilt 50 degree Measuring volume Max load area 300x300mm2 Max.sample weight 5kg Monitors 22" LCD Cabinet dimensions 1100x1100x1650mm Weight 1700kg Radiation safety2
Unicomp LX9200를 시험하는 PCB를 위한 높은 침투 인라인 3D CT 기계 엑스레이 기계
High penetration inline 3D CT machine X-Ray machine for PCB testing Unicomp LX9200 with real-time display Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type:BGA,LGA,CSP,POP,SIP... Defect type:Void,HIP,Insufficient,Bridge... Semiconductor
