bga x ray machine
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130KV 미크론 포커스 스팟 크기의 튜브 엑스레이 머신 유니컴 AX9100 업그레이드 모델 AX9100MAX PCB&BGA 검사용 듀얼 컴퓨터
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4
고성능 BGA 엑스레이 보안 스캐너 40AWG 광다이오드 엑스레이 발견자
Metro Museum Expo Center Security X-Ray Scanner Machine UNX6040E The UNX Series X-ray security detection machine release is a dynamic project associated with our Unicomp Technology Research and Development Manufacturing Division. Our full range of security machines are designed to address multiple safety requirements including internal detection of luggage, backpacks and express courier packages. The UNX Series machines are also effective for port logistics transportation,
플레이트 앨리겐먼트를 위한 5KW AX8800 독립식 X- 선 기계 100 킬로볼트
Cabinet Lithium Battery Automatic X-ray Inspection Machine AX8800 Features: ● Off-line lithium battery detection equipment ● 100KV 5μm closed X-ray tube, Hi-resolution detector ● X-ray tube and detector can be programmed to move to Z Axis ● Automatic control of all the moving parts, Automatic programming ● Convenient target point positioning system ● Automation software judgments detection Applications: ●Lithium battery pole piece solder joint defect detection, ●Lithium
오프라인 리튬 배터리 X- 선 기계 100 킬로볼트 AX8800 ISO9001
Cabinet Lithium Battery Automatic X-ray Inspection Machine AX8800 Applications: ● Lithium battery pole piece solder joint defect detection, ● Lithium battery batteries coiling case detection, ● BGA , CSP , LED , Flip Chip , Semiconductor, ● Battery Industry , Small Metal Casting, ● Electronic Connector Module, ● Aerospace Components , Photovoltaic Industry , ● Other Special Industries. Aftersales service: Ø A professional service team Ø Country-wide network Ø 24/7 hotline Ø
EMS SMT PCBA QFP를 위한 유니컴프 AX8200max FPD 검출기 X- 선 기계
CHINA Leading X-ray manufacturer Unicomp AX8200max machine for EMS SMT PCBA QFP IC SOT package reflow Soldering Void Inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3
CNC 풀그릴 검사를 위한 Unicomp AX8200Max 엑스레이 기계 6 축선 조작자
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
SMT PCB 엑스레이 기계 BGA 공허한 측정 및 소금 과거 등반 높이 검사
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
SMT PCB 엑스레이 머신 Unicomp AX9100MAX BGA 공허점 및 솔더 페이스트 검사를 위한 고해상도 미크론 초점점 크기
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
고 사양 전자 보드 2D 및 2.5D X-Ray 기계 Unicomp AX9100MAX 360도 회전 테이블과 함께 BGA 및 PCB 검사를 위해
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
