bga x ray machine
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전자 산업용 첨단 엑스레이 검사 장비 최대 부하 1000kg
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: Large Size Inspection Table,Laser Pinpoint For Precise Location Accurate Control, CNC Programming,Automatic Positioning FPD Tilting ±25° Safely Electromag
오디오 결함 정밀검사를 위한 유니컴프 X- 선 위험물 탐사 장치 90KV AX8200
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200ApplicationsBGA InspectionInspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high
LX2000 LED SMT BGA CSP를 검사하는 온라인 엑스레이 탐지 장비 회색 색깔
LX2000 Online X-ray Detection Equipment Checking LED SMT BGA CSP The LX-2000 is a versatile OnLine X-ray Machine designed for automated and semi-automated analysis. In addition to the OnLine capability, the LX-2000 can also be used in a Manual mode as a process monitoring/engineering workstation. High resolution x-ray images are generated using a closed microfocus 130kV tube with leading edge FPD (Flat Panel Display) detectors. This imaging chain combination is excellent for
BGA 검사 엑스레이 장비 22" CNC 풀그릴 탐지 기능을 가진 LCD
Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC programmable detection Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient
1KW 전력 소비 1280 L x 1220 W x 1615 H mm
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Inspection Table of Large Dimensions, Laser Pinpointing for Exact Positioning Precise Control
산업 전자 산업 철 1280x1220x1615mm에 대한 엑스레이 검사 장비
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Large-Scale Inspection Table with Laser Pinpointing for Precise Localization High-Precision
Unicomp AX8300H 110kV 마이크로포커스 X선 소스 및 고해상도 FPD를 갖춘 X선 검사기
110kV 마이크로초점 소스 및 360° 회전 기능을 갖춘 AX8300H X선 검사. BGA, CSP, 반도체 분석을 위한 고해상도 FPD 검출. <1μSv/h 누출로 FDA 안전 표준을 충족합니다.
SMD 케이블 전자공학 성분을 위한 고성능 Unicomp 엑스레이 발견자 AX8300
SMD Cable Electronics Components Unicomp X-ray Detector AX8300 The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect “In Between” design that offers a solution when 90kV is not enough energy and 130kV is too much. Using a state of the art FPD (Flat Panel Display) detection, the AX-8300 can generate extreme high magnification
Wearable Electronics 충전식 리튬 버튼 셀을 검사하기 위해 5μm Close Tube X-ray 적용
Applying 5μm close tube X-ray to inspect Wearable Electronics rechargeable Lithium button cell Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
