electronics x ray system
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유니컴프 SMD 칩 카운터 X- 선은 동적 AI 알고리즘과 클라우드 지원으로 릴과 제덱트레이를 공목을 넣습니다
Unicomp SMD Chip Counter X Ray quad reel and JEDEC tray with dynamic AI algorithm and Cloud support Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System
세미콘을 위한 SMT BGA X- 선 검출 장비 플립 침 FPD 검출기 130KV
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image
LED 점화를 위한 Linex 광선 짐 검열제도 CNC 동작 관리 형태에서
In-line X-Ray Inspection Machine for LED Lighting Unicomp Technology upholds its Integrity, Deploitation and Excellence in the business, is committed to meeting the highest level of International Standards and promises to be a responsive partner with all of our customers. This philosophy has enabled Unicomp to generated a strong Global customer base of many International Renowned companies including Flextronics, Foxconn, Samsung, Philips, GM, Bosch, Emerson, Delphi,ABB, BYD,
카트리지 히터를 위한 FPD 130kV X- 선 정밀검사 기계
Application Widely applied for BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with convenient target point
SMT BGA 점검 X- 선 칩 카운터 440 밀리미터 터널 CE
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
ERP MES 창고 데이터베이스 통합을 가진 엑스레이 SMD 칩 카운터 CX7000L 1.1kW
Unicomp CX7000L X-ray for SMD Chip Counter with ERP MES warehouse database integration Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows
쿼드 권선 관 포장을 위한 반도체 엑스레이 칩 카운터 440mm 갱도 CX7000L
China factory supply of SMD component counter X-ray CX7000L for quad reel, JEDEC Tray, Tube package Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System
경사 BGA 땜납 접합 전자공학 엑스레이 검사 기계 AX8300MAX Unicomp 자동 공극 분석
Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Key Features Professional
알루미늄 NDT 엑스레이 탐지 기계 항공 우주 자동 부속 UNC130
Aluminum NDT X ray Detection Machine Aerospace Automotive Parts UNC130 Features: ● 130kV,20μm X-ray tube, FPD; ● Multi-function workstation with 360°"ARC" motion and shift; ● C-arm fixture design enabling five-axis motion detection(Auto lift and descend); ● User friendly software design for easy interfacing can facilitate,customized software; ● Max. detection area Φ300*500mm. Applications: ● Precise casting parts and parts for Automobile ● Crop,Ceramics and Metal parts ●
