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industrial inspection systems

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품질 파이프 내부 용접 결함 감지를 위한 Unicomp 실시간 디지털 NDT X선 검사 시스템 UNC160S 공장

파이프 내부 용접 결함 감지를 위한 Unicomp 실시간 디지털 NDT X선 검사 시스템 UNC160S

Unicomp real time digital NDT X-ray Inspection System UNC160S for Pipe Inner welding flaws detection Our goal is to solve inspection problems with tailored systems, while guaranteeing a premium post-sales service. More than 15 years of expertise in industrial (NDT) and electronics applications combined with experienced engineers result in solutions that set new industry standards. Discover the invisible! 1. All Unicomp x-ray systems have CE approval. 2. Unicomp x-ray systems

품질 22" LCD 감시자 SMT EMS 납땜 결점 전자 검사 장비 고해상 공장

22" LCD 감시자 SMT EMS 납땜 결점 전자 검사 장비 고해상

Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending,

품질 PCBA 널 검사를 위한 HD 사진기 Unicomp 엑스레이 130kV 공장

PCBA 널 검사를 위한 HD 사진기 Unicomp 엑스레이 130kV

Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions

품질 세미콘을 위한 SMT BGA X- 선 검출 장비 플립 침 FPD 검출기 130KV 공장

세미콘을 위한 SMT BGA X- 선 검출 장비 플립 침 FPD 검출기 130KV

Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image

품질 BGA 검사 엑스레이 장비 22" CNC 풀그릴 탐지 기능을 가진 LCD 공장

BGA 검사 엑스레이 장비 22" CNC 풀그릴 탐지 기능을 가진 LCD

Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC programmable detection Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient

품질 BGA CSP/QFN/PoP 공허 검사를 위한 높은 확대 전자공학 엑스레이 체계 공장

BGA CSP/QFN/PoP 공허 검사를 위한 높은 확대 전자공학 엑스레이 체계

Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing

품질 CNC 풀그릴 탐지 전자공학 엑스레이 기계 골프 공 안 질 검사 공장

CNC 풀그릴 탐지 전자공학 엑스레이 기계 골프 공 안 질 검사

Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and

품질 질 검사 안쪽에 PCB BGA 검사 전자공학 엑스레이 기계 골프 공 공장

질 검사 안쪽에 PCB BGA 검사 전자공학 엑스레이 기계 골프 공

Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable

품질 자동차 캐스팅부 품질 검사를 위한 고해상도 NDT 엑스레이 시스템 공장

자동차 캐스팅부 품질 검사를 위한 고해상도 NDT 엑스레이 시스템

High Resolution NDT X-ray system for Automotive casting Parts Quality Inspection System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work environment 5-40° ≤80%HR Install power Three-phase five wire system AC380V X-ray leakage dose rate ≤1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area 145mm x 145mm Resolution 3.0LP/mm