microfocus x ray tube
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세륨 FDA를 가진 IC Semicon 지도 구조 검사를 위한 제 2 Microfocus 엑스레이 기계
2D microfocus X Ray machine for IC semicon Lead frame inspection with CE FDA compliance FEATURES of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm
130kV 3 um은 알루미늄 PCBA 납땜을 위한 X- 선 FPD 강의어를 미소초점을 맞춥니다
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
유니컴프 130kV는 무효 측정을 납땜질하여 주도하는 PCBA를 위한 엑스레이 AX9100을 미소초점을 맞춥니다
Unicomp 130kV microfocus X-ray AX9100 for Led PCBA soldering Void measurement Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery
유니컴프는 FPD 이미지를 위한 X- 선 정밀 검사 시스템 130kV 3 um을 미소초점을 맞춥니다
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power
130kV 수열음극 X선관구는 IGBT X- 선 기계를 위한 X- 선 원천을 미소초점을 맞춥니다
Unicomp 130kV Microfocus X-ray Source for Semiconductor IGBT X-ray Machine Key Parameter Max. Tube Voltage: 130kV Max. Tube Power: 65W Min. Spot Size:
130KV 리튬 배터리 내부 결함 검출용 마이크로포커스 X선
Unicomp 130kV Microfocus X Ray Source For EMS SMT PCBA BGA QFN X Ray Machine UNMS-U130B is a closed tube 130 kV Microfocus X-Ray Source using hot cathode technology, digital control and 100% domestic raw materials. It has the advantages of small focal spot size, high magnification, stable X-Ray emission, higher output power and strong penetration ability. The high voltage, control circuit and cooling unit are properly arranged within a compact space, with 24V DC power supply
100% 국내 원자재 유니컴 마이크로 포커스 엑스레이 소스 정밀 검사
100% Domestic Raw Material Unicomp Microfocus X Ray Source Key Parameter: Max. Tube Power: 25W Max. Tube Voltage: 110kV Beam Angle: 110±3° Beam Angle: 110±3° Min. Spot Size: ≤5μm Applications: Integrated Circuit Package SMT, PCBA ,Electronic Manufacturing EV Battery IGBT Substrate / Module Specifications: Operating Tube Voltage Range 40-110 kV Operating Tube Current Range 0-250 μA Maximum Tube Power 25W Input Voltage (DC) 25±0.5V Power Consumption ＜75W Window Material
유니컴프 AX8200MAX 5 um은 EMS 자동차 PCBA BGA QFN CSP 납땜 불량 점검을 위한 X-레이 기계를 미소초점을 맞춥니다
Unicomp AX8200MAX 5um microfocus X-Ray machine for EMS Automotive PCBA BGA QFN CSP soldering defects Inspection Specification Of Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
Microfocus X Ray Inspection Machine Close Tube 5KW For Lithium Battery
Cabinet Lithium Battery Automatic X-ray Inspection Machine AX8800 Applications: ●Lithium battery pole piece solder joint defect detection, ●Lithium battery batteries coiling case detection, ●BGA , CSP , LED , Flip Chip , Semiconductor, ●Battery Industry , Small Metal Casting, ●Electronic Connector Module, ●Aerospace Components , Photovoltaic Industry , ●Other Special Industries. Aftersales service: Ø A professional service team Ø Country-wide network Ø 24/7 hotline Ø Onsite
