pcb x ray inspection
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360° 교체 CNC 자동 MOSFET PCB 어셈블리 엑스레이 검사 시스템 AX8300MAX Unicomp 안정적인 성능
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Features 1. Professional semiconductor inspection configuration with 5μm ultra-high resolution 2. Extended detection scope,
PCBA 품질 테스팅을 위한 FPD 100 킬로볼트 Pcb X- 선 기계와 유니컴프 AX8200
Unicomp AX8200 automated smt pcb xray machine for computer motherboard repair The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
고 확대 PCB X-선 기계 Unicomp AX9100MAX 전자 IC 구성 요소 접착 유선 검사
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
SMT PCB 엑스레이 기계 BGA 공허한 측정 및 소금 과거 등반 높이 검사
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
SMT PCB 엑스레이 머신 Unicomp AX9100MAX BGA 공허점 및 솔더 페이스트 검사를 위한 고해상도 미크론 초점점 크기
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
BGA 공허/납땜을 위한 100kV PCBA 엑스레이 검열제도 Unicomp 전자공학
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification 600X Detector Intensifier 4”/2” (FPD Optional) Resolution 77/110 LP/cm Camera 200 Mega Pixel CCD Motion range (Up and Down) 290mm System Operating System Industrial PC, Win 7, i7
리튬 전지를 위한 FDA 0.8KW 엑스레이 검사 기계 FPD
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
축전기 안쪽 결손 전자 BGA X- 선 정밀 검사 시스템 자동차 측정
Capacitor Inner Defect Inspection with Electronics X-ray 100 KV Power AX8200MAX Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic
축전기 내부 결함 X- 선 정밀 검사 장비 마이크로는 전자적이어서 집중합니다
Micro Focus Electronics X Ray System For Capacitor Internal Defects Control Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features Fingerprint Access Management System Real-time Monitoring of Radiation 24’’ FHD Interactive Touch LCD Display Large Size Inspection Table Laser Locator for
