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security x ray machine

전자 엑스레이 검사기 AX7900 유니콤프 5μm 마이크로 포커스 자동 보이드 검출 BGA 솔더 고정밀

Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent

휴대폰 PCBA를 위한 0.8kW BGA 무효 측정 X- 선 기계

X-Ray Inspection Machine Electronics BGA Standard Multifunction Technical Data System SummaryFootprint1080(W)×1180(D)×1730(H)mmMachine Weight1050 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size146(W)×128(D)×196(H)cmPacking Weight1160 kgPower Consumption1.0 kWX-Ray TubeTube TypeSealedMax. Power8WVoltage0~90kV (Adjustable)Focus Spot Size5μmImaging SystemDetectorFlat Panel Detector (option 4’’ i.i. Detector)Pixel Size85μmEffective Detection Area130*130mmFrame Rates20fpsPi

다기능 DR CT 이중 이미징 산업용 X선 CT UNCT3500 Unicomp 비파괴 테스트

Multi-function DR CT Dual Imaging Industrial X-ray CT UNCT3500 Unicomp Non-Destructive Testing Detection purpose: Adaptable to a wide range of sizes and materials, this system meets the diverse industrial CT application requirements of various sectors. It is primarily utilized for the precision inspection of medium-to-large-scale products, including metal castings and non-ferrous metals, lithium-ion new energy battery modules, non-metallic workpieces, and composite materials.

안전에 인라인 원통 모양 리튬 전지 엑스레이 기계는 디자인을 동쪽으로 향하게 했습니다

In-line Cylindrical Lithium Battery X-ray Detector with Safety-oriented design The lithium battery X-Ray detection equipment of multiple types and full automation solely-developed by Unicomp Technology is targetted to inspect cells alignment metric and tabs soldering quality . It improves automation as well as gains high-definition internal images by means of X-ray imaging technology . This technology is widely applied to the detection of lithium battery in various types

초고해상도 정확한 솔더 보이드 검사 PCBA MOS 칩 X선 AX9600 Unicomp 전원 부품 PCB

Ultra High Resolution Accurate Solder Void Inspection PCBA MOS Chip X-ray AX9600 Unicomp Power Component PCB Unicomp Equipped with UNICOMP’s independently developed 160kV high-power open micro-focus X-ray tube, the AX9600 achieves an ultra-fine focal spot of 0.8μm. Combined with 2000× ultra-high optical magnification and superior X-ray penetration performance, it enables high-accuracy void fraction testing for TVS diodes. It is specially optimized for high-precision non

유니컴 UNC225 엑스레이 기계는 225kV의 0.4mm/1.0mm 초점 크기로 전력 樹脂의 결함을 식별합니다

Unicomp UNC225 X-Ray Identifies Flaws in Power resin Mainly used in metal castings, hardware products, plastic products, refractory materials, resin materials, composite materials, ceramic body and welding metal parts and other small products for non-destructive testing. Functional Characteristics 1. Wide range of applications to meet the inspection of multiple sizes and types of products. Low failure rate, best-selling equipment for 9 years 2. Safety: High level protection,

세라믹 부품의 내부 균열에 대한 Unicomp AX8300MAX 110KV X-Ray 검사

Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task

MOSFET 보이드 감지 및 신뢰성 분석을 위한 Unicomp 110KV X선 검사 AX8300MAX

유니컴 AX9600 160KV 오픈 튜브 2.5D 엑스레이 고밀도 TVS 다이오드 내부

Unicomp High-end Semiconductor X-Ray Inspection System AX9600 UNICOMP AX9600 features a self-developed 160kV high-power open micro-focus X-ray tube, delivering an ultra-small 0.8μm focal spot. With exceptional magnification up to 2000 times and outstanding ray penetration capacity, it accurately measures void ratio of TVS diodes, and is ideal for high-precision quality inspection of advanced IC packaging, HBM memory chips and GPU semiconductor components. Specifications:

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