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벌크 니트 장갑의 부러진 바늘 감지 Unicomp UNX6030 대형 패킹 감지
UNX6030-N X-ray Inspection System for Bulk Knitted Gloves The UNX6030-N is a compact X-ray inspection system specifically engineered for lightweight, small-bag packaged products. Optimized with advanced detection algorithms for low-density and thin-layer materials, this model excels at identifying ...
숨겨진 결함 감지 SUS 판 Weldong 레이저 용접 Tig 용접 UNICOMP UNC225
Detecting Hidden Defects SUS Plate Welding Laser Welding Tig Welding UNICOMP UNC225 Industrial X-Ray Inspection System Overview The UNICOMP UNC225 is a heavy-duty, high-stability industrial X-ray inspection solution designed for foundries, R&D centers, laboratories, and academic institutions. This ...
CSP LED 탁상용 엑스레이 기계 0.8KW Unicomp AX7900 DXI 시스템
Venous Indwelling needle inside assembly quality inspection by Unicomp AX7900 X-ray machine Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnificat...
칩 안 결함 검사를 위한 90KV 전자공학 엑스레이 기계 정확한 위치 레이저 거주
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease ...
노트북 배터리 용접 UNICOMP AX9100MAX 신에너지 셀 검사 장치용 FPD 스티치 이미지 기능
AX9100MAX X-Ray Inspection System High-precision non-destructive testing system optimized for laptop battery welding inspection and new energy cell analysis with advanced FPD stitched image functionality. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete ...
84μm 픽셀 크기의 전기 면도기용 X-Ray 검사 장비
X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It is broadly utilized in various sectors such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small-scale Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, ...
플래트 패널 탐지기로 업그레이드 1536 * 1536mm 픽셀 행렬의 IC를위한 FPD X-Ray 검사 장비
X-Ray Inspection Equipment for IC Description of IC X Ray machine AX7900: It has extensive applications in diverse fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, Miniature Metal Casting, Electronic Connector Assemblies, Wiring, Aerospace Parts, and ...
감지기 최대 60° 틸트 360° 회전 스테이지 BGA AX8300MAX Unicomp HIP 헤드인필로우 검사기
AX8300MAX X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconduc...
