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품질 Unicomp UNC160 NDT X-Ray Inspection Equipment for Automotive Components 공장

Unicomp UNC160 NDT X-Ray Inspection Equipment for Automotive Components

Unicomp UNC160 NDT X-Ray Inspection Equipment for Automotive Components Product Description Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection

품질 엑스트라 라지 검사 지역을 가진 어미판 Bga 엑스레이 검열제도 공장

엑스트라 라지 검사 지역을 가진 어미판 Bga 엑스레이 검열제도

Extra large inspection area and plenty of power PCB X RAY Machine for BGA The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

품질 고속 LED 스트립 온라인 ADR 엑스레이 검사 장비 FPD 감지기 130kv 공장

고속 LED 스트립 온라인 ADR 엑스레이 검사 장비 FPD 감지기 130kv

Unicomp High Speed inline SMT PCBA X-Ray Inspection System with Automotive Identification OK / NG Result Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage

품질 태양 전지 납땜을 위한 CSP X- 선 정밀검사 기계 90kV 공장

태양 전지 납땜을 위한 CSP X- 선 정밀검사 기계 90kV

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

품질 LCD는 1.0kW X- 선 정밀검사 기계 유니컴프 AX8200 BGA 점검을 드러냅니다 공장

LCD는 1.0kW X- 선 정밀검사 기계 유니컴프 AX8200 BGA 점검을 드러냅니다

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

품질 차량 부품에 대한 320Kv X- 선 정밀 검사 장비 CNC 통제 공장

차량 부품에 대한 320Kv X- 선 정밀 검사 장비 CNC 통제

Dynamic Precise Casting Part Inspection Real Time X-ray Image System The UNC320 is the newest standard system. Whether you are inspecting small or large components, the UNC320 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system. System Parameters Dimensions 2100mm*1720mm*2470mm(L*W*H) Equipment weight 3.5T Power 6kW Maximum penetration (AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight

품질 1uSv/H 리튬 배터리 X- 선 정밀 검사 장비 BGA CNC 매핑 공장

1uSv/H 리튬 배터리 X- 선 정밀 검사 장비 BGA CNC 매핑

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200B The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

품질 반도체를 위한 유니컴프 AX8200MAX X- 선 정밀 검사 장비 공장

반도체를 위한 유니컴프 AX8200MAX X- 선 정밀 검사 장비

Unicomp AX8200 X Ray Inspection Equipment For Semiconductor Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable)

품질 유니컴 UNX 1830-D 엑스레이 검사 병에 담긴 식품의 안전과 품질을 보장 공장

유니컴 UNX 1830-D 엑스레이 검사 병에 담긴 식품의 안전과 품질을 보장

Unicomp UNX 1830-D X-Ray Inspection Ensure Safety and Quality for Bottled Foods Product Description: Our cutting-edge X-Ray inspection solution tailored for bottled and canned food items, ensures unparalleled quality control for glass jars, dairy goods, tin cans, and porcelain liquor bottles. It identifies contaminants with unparalleled precision, safeguarding consumer wellbeing and upholding brand integrity. Features: User-Centric Operation: Effortless one-touch activation

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