x ray inspection system
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핸들 Diecasting 유공성 체크를 위한 Unicomp 주조 주조 NDT 엑스레이 체계
Steering Wheel Diecasting Porosity Quality check with Unicomp NDT X ray System Technical Data of UNC160s Attribute Respective Value Sample Dimensions Outer width: 250 [mm] max. Outer diameter: 550 [mm] max. Maximum Sample Weight 15 [kg] System Dimension 1480mm*1106mm*2038mm(L*W*H) X-ray Tube 160 [kV] Detector Active Area 250*550mm Pixel Pitch 139 [m] Maximum penetration(AL) 100mm/20mm Detector Resolution 3.1LP/mm Our goal is to solve inspection problems with tailored systems,
정확한 PCB/BGA 검사를 위한 높은 정밀도 UNICOMP 엑스레이 CT 기계 AX9500
High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum
PCB 층 검사를 위한 3D 엑스레이 오프라인 CT 검열제도 Unicomp AX9500
3D X-Ray computed temography offline CT Inspection system unicomp AX9500 for PCB layers inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum die-casting
90kV 5μm 해상도 본딩 와이어 반도체 엑스레이 테스터 CX300 Unicomp 금 본드 검사 장비
CX300 Unicomp Gold Bond Inspection Equipment 90kV 5μm Resolution Bonding Wire Semiconductor X-ray Tester for precise inspection and quality control. Applications BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, Photovoltaic Industry, and other specialized industries. Key Features Super Compact Desktop Design Multi-function X-Ray Inspection Multiple Inspection Modes Portable with Wheels Status
주물 160KV의 NDT Unicomp 엑스레이 시스템 UNC160-C-L 엑스레이 테스트
NDT Unicomp X-Ray Systems UNC160-C-L Die Castings Pipe Inspection Features: * The implementation of automatic location detection * Automatic identification of defect detection * The unqualified product identification marking * OK and NG are sorting and recognition * High contrast, high quality image detection * Extended-modular design, strong, automatic loading and unloading * Adopt the design of transmission mechanism of high speed positioning, multi axis motion detection
고성능 전자공학 엑스레이 기계, 22 인치 Lcd 감시자를 가진 SMT PCB 엑스레이 기계
Electronics X Ray Machine SMT BGA X-ray Detection Equipment for PCB X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● 7
썰물 분석 SMT/EMS 엑스레이 기계, 산업 검열제도를 납땜하십시오
Metal X Ray Machine Solder reflow analysis for PCB / BGA / LED X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power
130kV는 점검을 납땜질하여 SMT PCBA BGA를 위한 유니컴프 AX9100의 엑스레이를 미소초점을 맞춥니다
130kV microfocus X-ray of Unicomp AX9100 for SMT PCBA BGA soldering Inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery
자동차 측정과 일치하는 세미콘 리드프레임 품질을 위한 2.5D 110 킬로볼트 X- 선 기계 유니컴프 AX8500
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
