EeIE 2026 | Unicomp: Insights at the Micron‑Scale, Strength Made Tangible
2026/08/27
Rooted in the Greater Bay Area, Embracing the World
Intelligence Shapes the Future, Industry Drives Growth
EeIE 2026 & UNICOMP
August 26‑28, 2026
The 10th Shenzhen International Intelligent Equipment Industry Expo and
the 13th Shenzhen International Electronic Equipment Industry Expo
(EeIE Expo)
Grandly kick off at Shenzhen World Exhibition & Convention Center.
the 13th Shenzhen International Electronic Equipment Industry Expo
(EeIE Expo)
Covering an exhibition area of 80,000 ㎡, this edition of EeIE Expo gathers over 300 leading equipment enterprises at home and abroad and draws more than 30,000 global professional buyers. It attracts participants from the whole‑industry‑chain sectors including semiconductors, 3C electronics, automotive electronics, new‑energy industries and automated production lines.
UNICOMP (Booth No.: Hall 13‑C001) addresses the core non‑destructive‑testing requirements of semiconductor and electronics manufacturing — clear visibility, fast inspection and accurate judgment. The company delivers end‑to‑end, one‑stop AI‑powered X‑ray non‑destructive testing solutions, capable of identifying a full range of hidden defects. These solutions cater to quality‑control demands across multiple industries, including semiconductor electronics, new‑energy sectors, advanced packaging and optical modules.
AX9500: Near‑Nanoscale Industrial 3D‑CT X‑ray Inspection System
Multi‑Modal Imaging for Precision Components
Featuring four imaging modes (2D / 2.5D / Cone‑beam CT / Slice CT), the system accurately detects advanced‑packaging defects such as bump bridging, chip cold solder joints and MEMS voids, fully meeting customer requirements across diverse application scenarios.
Featuring four imaging modes (2D / 2.5D / Cone‑beam CT / Slice CT), the system accurately detects advanced‑packaging defects such as bump bridging, chip cold solder joints and MEMS voids, fully meeting customer requirements across diverse application scenarios.
AX9600: Semiconductor Open‑Tube AI‑Driven X‑ray Inspection Equipment
High‑Density Thick‑Material Inspection with Near‑Nanoscale Resolution
Boasting an ultra‑high geometric magnification ratio, the system readily detects a wide range of defects in 3D and system‑in‑package (SiP), IC wire‑bonding and other processes. It captures fine details of micro‑features within TGV and TSV structures, effectively breaking through long‑standing bottlenecks for highly‑challenging defect inspection in the industry.
Boasting an ultra‑high geometric magnification ratio, the system readily detects a wide range of defects in 3D and system‑in‑package (SiP), IC wire‑bonding and other processes. It captures fine details of micro‑features within TGV and TSV structures, effectively breaking through long‑standing bottlenecks for highly‑challenging defect inspection in the industry.
LX9200: In‑line 3D Precision AI‑Powered Inspection Equipment
Rapid Reconstruction for Complex Components Within Seconds
Combining high‑speed snapshot imaging technology with 360° oblique projection, the system rapidly reconstructs the internal structures of high‑density and special‑shaped parts. It captures sub‑micron‑scale defects such as cold solder joints, voids and cracks at high speed, meeting enterprises’ demands for high‑quality quality control and high‑volume automated production‑line operations.
Combining high‑speed snapshot imaging technology with 360° oblique projection, the system rapidly reconstructs the internal structures of high‑density and special‑shaped parts. It captures sub‑micron‑scale defects such as cold solder joints, voids and cracks at high speed, meeting enterprises’ demands for high‑quality quality control and high‑volume automated production‑line operations.
Full‑Spectrum Coverage of Core Components
In‑house development of X‑ray sources not only safeguards supply‑chain security and delivery lead times, but also enables deep collaborative optimization among the X‑ray source, detector and algorithms. This capability supports high‑end customized requirements and continuous technological iteration.
In‑house development of X‑ray sources not only safeguards supply‑chain security and delivery lead times, but also enables deep collaborative optimization among the X‑ray source, detector and algorithms. This capability supports high‑end customized requirements and continuous technological iteration.
Self‑Reliable & Controllable, Secured Mass‑Production
UNICOMP’s self‑developed micro‑focus X‑ray source series achieves full‑spectrum voltage coverage ranging from 90 kV to 225 kV. With industrial‑scale commercial deployment worldwide, it delivers self‑reliable core‑technology support for high‑end intelligent inspection.
UNICOMP’s self‑developed micro‑focus X‑ray source series achieves full‑spectrum voltage coverage ranging from 90 kV to 225 kV. With industrial‑scale commercial deployment worldwide, it delivers self‑reliable core‑technology support for high‑end intelligent inspection.
Moving forward, UNICOMP will continue to deepen its layout in the intelligent inspection track. Driven by the dual engines of in-house core technology R&D and strategic mergers and acquisitions, the company will continuously build a multi-modal intelligent inspection system to empower zero-defect manufacturing in the high-end manufacturing industry.
