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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

기본 특성
원산지: 중국
브랜드 이름: UNICOMP
인증: CE, FDA
모델 번호: AX9100max
부동산 거래
최소 주문 수량: 1세트
가격: can negotiate
지불 조건: 신용장, 티/티
공급 능력: 100 세트 / 몬트르에
제품 요약
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...

제품 세부정보

강조하다:

Unicomp AX9100max X-ray inspection system

,

Flip-Chip BGA X-ray machine

,

FCBGA packaging analysis equipment

Monitor: 27 "HD 디스플레이
System OS: Windows10 64비트
Hard Disk: 1TB
RAM: 16G
CPU Model: I7
제품 설명
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
전체 등급
5.0
★★★★★
★★★★★
최근 50개의 리뷰를 바탕으로
스타 5명
100%
별 4개
0
3 별
0
별 2개
0
별 1개
0
모든 리뷰
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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