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Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control

기본 특성
원산지: 중국
브랜드 이름: UNICOMP
인증: CE, FDA
모델 번호: AX8300
부동산 거래
최소 주문 수량: 1세트
가격: can negotiate
지불 조건: T/T,L/C
공급 능력: 달 당 30 세트
제품 요약
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...

제품 세부정보

강조하다:

Semiconductor BGA X-ray inspection machine

,

Flip Chip X-ray machine with warranty

,

UNICOMP fingerprint access control X-ray

Product Name: AX8300
Dimension: 1215*1325*1700(mm)
Power Supply: 220V,50Hz/60Hz 4A
Weight: 1350kg
Voltage: 110kV
Warranty: 1년
제품 설명
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient
전체 등급
5.0
★★★★★
★★★★★
최근 50개의 리뷰를 바탕으로
스타 5명
100%
별 4개
0
3 별
0
별 2개
0
별 1개
0
모든 리뷰
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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