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IC BGA CSP QFN Packaging Inspection X-ray AX8300MAX UNICOMP 4K Flat Panel Detector

기본 특성
원산지: 중국
브랜드 이름: UNICOMP
인증: CE, FDA
모델 번호: AX8300MAX
부동산 거래
최소 주문 수량: 1세트
가격: can negotiate
지불 조건: T/T,L/C
공급 능력: 달 당 30 세트
제품 요약
AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system engineered for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality ...

제품 세부정보

강조하다:

BGA packaging inspection X-ray machine

,

CSP X-ray detector with 4K resolution

,

QFN X-ray machine with flat panel

Model: AX8300MAX
Motion Control Mode: 마우스, 키보드, 조이스틱
Tilt And Rotation: 감지기 일측 기울기 최대 60°
Monitor: 27형 HD 4K 디스플레이
System OS: Windows11 64비트
Power Consumption: 900W
Tube Type: 봉인
제품 설명
AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system engineered for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die castings, injection
전체 등급
5.0
★★★★★
★★★★★
최근 50개의 리뷰를 바탕으로
스타 5명
100%
별 4개
0
3 별
0
별 2개
0
별 1개
0
모든 리뷰
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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