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High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System

기본 특성
원산지: 중국
브랜드 이름: UNICOMP
인증: CE, FDA
모델 번호: AX9100max
부동산 거래
최소 주문 수량: 1세트
가격: can negotiate
지불 조건: 신용장, 티/티
공급 능력: 달 당 30 세트
제품 요약
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of ...

제품 세부정보

강조하다:

PCBA BGA solder test X-ray equipment

,

SMT IC inspection X-ray machine

,

high resolution X-ray equipment for PCBA

Machine Type: 반도체 전자 X-Ray 검사 시스템
Model: AX9100max
X-Ray Tube Type: 밀봉형
Pixel Size: 84μm
Pixel: 1536*1536
Footprint: 1450(W)×1765(D)×1835(H)mm
제품 설명
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of electronics IC components and bonding wire analysis. It is widely deployed across industrial and semiconductor applications for quality control and R&D verification. Applications BGA,
전체 등급
5.0
★★★★★
★★★★★
최근 50개의 리뷰를 바탕으로
스타 5명
100%
별 4개
0
3 별
0
별 2개
0
별 1개
0
모든 리뷰
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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