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High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp

기본 특성
원산지: 중국
브랜드 이름: UNICOMP
인증: CE, FDA
모델 번호: AX9500
부동산 거래
최소 주문 수량: 1세트
가격: can negotiate
지불 조건: T/T,L/C
공급 능력: 달 당 300 세트
제품 요약
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and ...

제품 세부정보

강조하다:

FPD SMT X-ray inspection machine

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BGA packaging X-ray machine

,

Unicomp AX9500 X-ray inspection

Name: 유니컴프 X-레이 정밀검사 기계
Application: SMT, EMS, BGA, 전자, 이끌리는 CSP, 플립 침, 반도체
Industry: 전자 산업
X-Ray Leakage: < 1uSv="">
제품 설명
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, while also supporting SMT welding analysis with advanced 3D tomography CT scanning technology (planar CT + cone beam CT). Applications Semiconductor industry SMT
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