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High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System

기본 특성
원산지: 중국
브랜드 이름: UNICOMP
인증: CE, FDA
모델 번호: AX9500
부동산 거래
최소 주문 수량: 1세트
가격: can negotiate
지불 조건: T/T,L/C
공급 능력: 달 당 300 세트
제품 요약
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, ...

제품 세부정보

강조하다:

FPD detector BGA defect analysis

,

Unicomp SMT welding system

,

X-ray head-in-pillow inspection

Name: 유니컴프 X-레이 정밀검사 기계
Application: SMT, EMS, BGA, 전자, 이끌리는 CSP, 플립 침, 반도체
Industry: 전자 산업
X-Ray Leakage: < 1uSv="">
제품 설명
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, plus SMT welding analysis with advanced 3D tomography CT scanning capabilities. Applications Semiconductor industry inspection SMT
관련 제품

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