logo
환영합니다 Unicomp Technology
+86-13502802495

Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection

기본 특성
원산지: 중국
브랜드 이름: UNICOMP
인증: CE, FDA
모델 번호: AX8300MAX
부동산 거래
최소 주문 수량: 1세트
가격: can negotiate
지불 조건: T/T,L/C
공급 능력: 달 당 30 세트
제품 요약
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable ...

제품 세부정보

강조하다:

Unicomp AX8300MAX X-ray inspection machine

,

BGA automated void detection X-ray

,

110KV X-ray machine for electronics

Motion Control Mode: 마우스, 키보드, 조이스틱
Tilt And Rotation: 감지기 일측 기울기 최대 60°
Monitor: 27형 HD 4K 디스플레이
System OS: Windows11 64비트
Power Consumption: 900W
제품 설명
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and
관련 제품

문의 를 보내십시오