전자공학 엑스레이 기계
구멍 엑스레이 검사 기계 AX8300 Unicomp PTH 공백 결함 발견자를 통해서 도금되는 5μm 초점 반점 PCBA
5μm Focus Spot PCBA Plated Through Hole X-ray Inspection Machine AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray ...
LED 램프 비드 솔더 보이드 및 와이어 파손을 위한 90KV 산업용 엑스레이 검사 기계 AX7900 UNICOMP
90KV Industrial X-ray Inspection Machine AX7900 for LED Lamp Bead Solder Void and Wire Breakage UNICOMP Product Overview The AX7900 industrial X-ray inspection system features a high-performance 90kV X-ray tube with 5μm ultra-high resolution and a high-sensitivity FPD flat-panel detector. Built with ...
IGBT 솔더 보이딩 분석을 위한 110KV 산업용 X선 검사 기계 UNICOMP AX8300MAX
110KV Industrial X-ray Inspection Machine for IGBT Solder Voiding Analysis UNICOMP AX8300MAX This advanced industrial X-ray inspection system is specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial ...
반도체 와이어 본딩용 160KV 마이크로포커스 X선 검사 기계 NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp The UNICOMP AX9600 160KV microfocus X-ray inspection system is equipped with a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. Supporting a ...
60° 경사 다각 스캔 숨겨진 솔더 결함 감지 PCBA BGA 엑스레이 AX9100 UNICOMP 반 시험기
60° Tilt Multi-angle Scan Hidden Solder Defect Detection PCBA BGA X-ray AX9100 UNICOMP Semi Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High ...
90kV 5μm 해상도 결합 와이어 반도체 엑스레이 검사기 CX3000 유니컴 골드 본드 검사 장비
CX300 Unicomp Gold Bond Inspection Equipment 90kV 5μm Resolution Bonding Wire Semiconductor X-ray Tester for precise inspection and quality control. Applications BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, ...
고화질 2.5D 이미징 중첩 공백 BGA X선 AX9100 UNICOMP SMT 조립 검사 장비
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment Product Overview The Unicomp AX9100 represents advanced X-ray inspection technology for comprehensive SMT assembly quality control, featuring high-definition 2.5D imaging and specialized void ...
PCBA 제조 품질 보증을 위한 BGA 보이드 솔더 조인트 검사 UNICOMP AX8300 X-Ray 시스템
SMT electronics x ray machine sealed type X-ray Tube x-ray 110kv AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ...
360° 교체 CNC 자동 MOSFET PCB 어셈블리 엑스레이 검사 시스템 AX8300MAX Unicomp 안정적인 성능
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ...
