bga x ray inspection system
"
CX3000 릴이 CSP 주도하는 플립 침을 위한 삼성전자 X- 선 기계 0.5kW를 끌어당깁니다
Brand New Generation of CX3000 with Reel to Reel Function Making It More Competitive Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle
고해상도 90kV 벤치 톱 PCB 전자 부품용 X선 기계 Unicomp AX7900
5 μm Micro focus X-Ray machines Unicomp AX7900 for semicon IC components wire bonding testing Description of AX7900 : 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
PCBA 제조 품질 보증을 위한 BGA 보이드 솔더 조인트 검사 UNICOMP AX8300 X-Ray 시스템
SMT electronics x ray machine sealed type X-ray Tube x-ray 110kv AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Major applications: PCBA BGA/IC LED Aliminum die casting Battery connector inspecting 1. Semiconductor package 2. Electronic connector module. 3
BGA, CSP, LED & 반도체를 위한 CX3000 벤치 탑 전자공학 엑스레이 기계
CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor X ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. X ray Inspecting Features: (1) Coverage of process defects up to 97%.
BGA 연결성과 분석 AX9100를 위한 UNICOMP 금속 엑스레이 기계
Metal X Ray Machine for BGA connectivity and analysis AX9100 Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
130kV 밀봉 튜브 60°틸트 BGA 솔더 조인트 전자공학 엑스레이 검사 기계 AX9100 Unicomp 자동 무효 계산
130kV Sealed Tube 60°Tilt BGA Solder Joint Electronics Xray Inspection Machine AX9100 Unicomp Auto Void Calculation Features: ●130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconducto
자동차 측정과 일치하는 세미콘 리드프레임 품질을 위한 2.5D 110 킬로볼트 X- 선 기계 유니컴프 AX8500
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
SMT BGA Soldering Void Measurement X-Ray Machine Microfocus 130kV
130kV 7 μm Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One
LED 지구 PCBA 납땜을 위한 CSP LED 110kV 엑스레이 스캐너 5um
110kV 5um microfocus AX8500 X-ray for LED Strip PCBA soldering void quality control Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size
