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industrial inspection systems

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품질 강력한 160kV 전압 UNS NDT 엑스레이 장비 종합 검사 장치 공장

강력한 160kV 전압 UNS NDT 엑스레이 장비 종합 검사 장치

UNS NDT X-Ray Equipment All-in-One Inspection Device Product Description: Primarily intended for non-destructive testing of various small-scale products, this equipment finds extensive application in examining metal castings, hardware components, plastic products, refractory materials, resin-based materials, composite materials, ceramic bodies, as well as welded metal parts. Its versatility ensures a comprehensive inspection process for a diverse range of small items.

품질 첨단 UNL 시리즈 NDT X-RAY 기계 타이어 검사 DR U 타입 라인 배열 탐지 공장

첨단 UNL 시리즈 NDT X-RAY 기계 타이어 검사 DR U 타입 라인 배열 탐지

UNL Series NDT X-RAY Machine For Tire Inspection(DR) Product Description: UNL type X-ray intelligent testing equipment is a special testing equipment for automobile tires independently developed by Unicomp. Mainly used in automobile tire defect detection (tire internal foreign objects, parts do not meet requirements (missing or more), Radial cords(including open splices), cord fold, distortion, splices overlap,layer difference beyond standard,blisters or separation, radial

품질 스티어링 손목 엑스레이 검사 기계 Unicomp UNZ225 225KV NDT 디지털 방사선 기계 내부 균열 공장

스티어링 손목 엑스레이 검사 기계 Unicomp UNZ225 225KV NDT 디지털 방사선 기계 내부 균열

Steering knuckle X-ray inspection machine Unicomp UNZ225 225KV NDT digital radiagraphy machine for internal cracks The UNZ series is one of Unicomp Technology most popular models for aluminum casting, aerospace components and steel pipe. It offers an excellent balance of power and space sensitivity. The system can handle products up to 120cm in size while seated nicely in your failure analysis lab or busy production line. Product Features The pallet inspection platform can

품질 효과적 탐지 영역 129x129mm 전기 면도 1280x1220x1615mm에 대한 엑스레이 검사 장비 공장

효과적 탐지 영역 129x129mm 전기 면도 1280x1220x1615mm에 대한 엑스레이 검사 장비

X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It finds extensive application in numerous domains, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small-scale metal casting, electronic connector modules, cables, aerospace components, and the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A Large-Scale Laser Pinpoint Inspection Table for Accurate Localization

품질 플래트 패널 탐지기로 업그레이드 1536 * 1536mm 픽셀 행렬의 IC를위한 FPD X-Ray 검사 장비 공장

플래트 패널 탐지기로 업그레이드 1536 * 1536mm 픽셀 행렬의 IC를위한 FPD X-Ray 검사 장비

X-Ray Inspection Equipment for IC Description of IC X Ray machine AX7900: It has extensive applications in diverse fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, Miniature Metal Casting, Electronic Connector Assemblies, Wiring, Aerospace Parts, and Photovoltaic Industry, to name a few. FEATURES of IC Xray machine AX7900: Precision Positioning Laser Pointer System Installed on a Large Inspection Table Accurate Control, CNC

품질 UNS160 모터사이클 피스톤 검사용 엑스레이 시스템 공장

UNS160 모터사이클 피스톤 검사용 엑스레이 시스템

Unicomp UNS160 X-Ray System for Motorcycle Piston Inspection Product Description: Designed primarily for non-destructive testing of a wide variety of small-scale products, this equipment has broad applications in inspecting metal castings, hardware components, plastic items, refractory substances, resin materials, composites, ceramic bodies, and welded metallic parts. Its versatility guarantees a thorough examination process for a multitude of small items. Features:

품질 유니컴 AX9100max X선 기계 2400kg MOS 튜브 검사 공장

유니컴 AX9100max X선 기계 2400kg MOS 튜브 검사

Unicomp X-ray AX9100max For Internal Defect Inspection Of MOS Tube Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance

품질 Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 공장

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application

품질 Unicomp 엑스레이 검열제도는 외교 문제 오염의 위험을 감소시킵니다 공장

Unicomp 엑스레이 검열제도는 외교 문제 오염의 위험을 감소시킵니다

Unicomp X-ray inspection system reduces risk of foreign matter contamination Unicomp X-ray inspection system scans for contaminants and checks for foreign bodies in dry bulk powders, baking and snack products, cereal and crackers. It detects and automatically rejects contaminants, including glass shards, metal fragments, mineral stone, and some plastic and rubber compounds. The system includes software that collects data that can be stored centrally and used with optional