pcb x ray inspection
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QFN CSP를 위한 90kV 5 um CNC 프로그램 가능한 X- 선 기계 AX8200MAX
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 90kV/100kV Max.Power 8W Spot Size 5μm X-ray System Intensifier 4"Image Intensifier Monitor 22"LCD System Magnification 600x Detection Region Max.Loading Size 510mm x 420mm Max.Inspection Area 435mm x 385mm X-ray Leakage < 1uSv/h OUR SERVICE
케이블 연결기를 위한 CSP 전자 X- 선 기계 UNICOMP CX3000
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high
SMT 주도하는 납땜을 위한 90kV 폐관법 0.8kW X- 선 시스템
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
BGA CSP를 위한 유니컴프 AX8200 100KV X- 선 주사 기계
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
SMT PCBA BGA CSP를 위한 90kV 5 um 유니컴프 X- 선 스캐너
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application fields
다기능 전자공학 엑스레이 기계, 건전지 기업을 위한 BGA 엑스레이 검열제도
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
자동차 리젝터와 신선육 안에서 이물을 확인하기 위한 식품 X- 선 정밀검사 기계
Food X ray inspection machine for checking foreign matters inside fresh meat with auto rejector APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass,
전자 보드 2D 및 2.5D X선 기계 AX9100MAX 360도 회전 테이블과 함께 BGA&PCB
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
