발견 275 제품 "

pcb x ray inspection

무효 점검과 PTH 납땜 비율 측정을 납땜질하는 SMT PCBA BGA를 위한 AX9100 130kV 폐관법 X-레이 기계

AX9100 130kV closed tube X-Ray machine for SMT PCBA BGA soldering Void inspection and PTH soldering rate measurement Features of X-Ray machine AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of X-Ray machine AX9100: ●

유니컴프 AX8200MAX 5 um은 EMS 자동차 PCBA BGA QFN CSP 납땜 불량 점검을 위한 X-레이 기계를 미소초점을 맞춥니다

Unicomp AX8200MAX 5um microfocus X-Ray machine for EMS Automotive PCBA BGA QFN CSP soldering defects Inspection Specification Of Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

FPD 검출기와 IGBT BGA QFN X- 선 스캐너 AX8200MAX

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 OUR SERVICE Your inquiry will be replied in 12 hours. Original Manufacture to customers, with competitive price. We provide one year warranty, free training and whole life technology support. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you,and will give you the tracking NO. after shipment. Well-trained and Professional after-sales service team to support you. Manual will

PCBA 리플로우 납땜을 위한 100KV 전자 X- 선 기계 0.8kW

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

유니컴프 AX8200B 버튼 리튬 배터리 X- 선 기계 5 um 포쿠 사이즈 90kV 시일관

Unicomp 5um 90kV sealed tube X-Ray Inspection Machine AX8200B for button Lithium battery inspection Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process

유니컴 엑스레이 시스템 AX8200max 다중 측정 도구

Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

AX8200max 전자 엑스레이 기계 6축 360도 회전 옵션

Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application

PCB SMT BGA LED 전자공학 엑스레이 기계 고성능 엑스레이 근원 100KV

PCB , SMT , BGA , LED Electronics X Ray Machine high power x-ray sources X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging

페이지 22 의 31