pcb x ray inspection
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통합 발전기 SMT/고해상 화상 진찰 사슬을 가진 EMS 엑스레이 기계
Metal X Ray Machine with integrated generator & a high-resolution imaging chain The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
LED/플립칩/반도체를 위한 실험실 벤치 탑 엑스레이 기계
Laboratory Benchtop X Ray Machine for PCB , LED , Flip Chip , Semiconductor Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray
EMS SMT PCB 전자 X- 선 기계 BGA QFN은 무효 NDT 정밀 검사 장비를 납땜질하여 이르렀습니다
Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Application Fields of X Ray Machine AX8200Max SMT/PCBA Inspection Semiconductor Inspection Lithium Batteries Inspection LED Inspection Photovoltaic
130KV 마이크로 폼 포커스 스팟 사이즈 튜브 엑스레이 기계 AX9100MAX PCB&BGA 검사용 듀얼 컴퓨터
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
고 사양 전자 보드 2D 및 2.5D X-Ray 기계 Unicomp AX9100MAX 360도 회전 테이블과 함께 BGA 및 PCB 검사를 위해
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
중국 유니컴프 AX8200 BGA / IC / PCB는 공장도 가격으로 X-레이 기계를 닫았습니다
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
초고해상도 정확한 솔더 보이드 검사 PCBA MOS 칩 X선 AX9600 Unicomp 전원 부품 PCB
Ultra High Resolution Accurate Solder Void Inspection PCBA MOS Chip X-ray AX9600 Unicomp Power Component PCB Unicomp Equipped with UNICOMP’s independently developed 160kV high-power open micro-focus X-ray tube, the AX9600 achieves an ultra-fine focal spot of 0.8μm. Combined with 2000× ultra-high optical magnification and superior X-ray penetration performance, it enables high-accuracy void fraction testing for TVS diodes. It is specially optimized for high-precision non
세미콘 칩 안쪽 결점 점검을 위한 고해상도 X-레이 기계 AX8200MAX
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
칩셋트 결손을 위한 HD PFD 정밀 검사 시스템과 중국 유니컴프 90KV 엑스레이가 탐색합니다
China Unicomp 90KV X-ray with HD PFD Inspection System for Chipset Defects Detecting Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
