pcb inspection equipment
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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
다기능 전자공학 엑스레이 기계, 건전지 기업을 위한 BGA 엑스레이 검열제도
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
PCB SMT BGA LED 전자공학 엑스레이 기계 고성능 엑스레이 근원 100KV
PCB , SMT , BGA , LED Electronics X Ray Machine high power x-ray sources X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging
SMT 1kW 90KV BGA 비오즈 X- 선 검출 설비
Features • Multi-function DXI image processing system, CNC programmable detection • Multi-function workstation with ±60° tilt and X-Y multi-axis movement • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • X-ray tube & detector automatic lifting and descending, with convenient target point positioning system • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification X-ray Images Item Description Specifications X-Ray
파인포퀴스는 PCBA 점검을 위해 100KV X- 선 스캐너 AX8200을 관을 답니다
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. Technical Data
CSP 리튬 배터리 엑스레이 스캐너 기계 Unicomp 오프라인 모델 AX8200B
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
플립칩, 옥수수 속을 위한 AC 110-220V 전자공학 엑스레이 기계 다재다능한 체계
Electronics X Ray Machine for BGA , CSP , LED , Flip Chip , Semiconductor OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to support you. 6
Unicomp LX9200 3D CT 엑스레이는 PCB BGA 검사를 위해 인라인으로 Temography 기계 130KV를 계산했습니다
Unicomp high quality 130KV inline Unicomp LX9200 3D CT X-Ray computed temography machine for PCB BGA inspection Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge...
PCBA BGA CSP QFN을 위한 x선 설비의 프로그램을 짜는 CNC와 유니컴프 AX9100 자동 측정은 납땜 품질을 역류합니다
Unicomp AX9100 Automatic measurement with CNC programming X-Ray equipment for PCBA BGA CSP QFN reflow soldering quality Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube.● High speed & Millions pixels high resolution FPD.● 1000X magnification, high-definition real-time image.● One-button operation with 2.5D image display.● Off-line programming function, navigation mode detection.● 7 axis linkage, 70 degree tilt detection.Applications of Unicomp AX9100: ● SMT, BGA, CSP,
