x ray imaging system
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건조한 합동 탐지 및 분석을 위한 높은 자동화 Bga 엑스레이 기계
Dry joint detection and analysis BGA X-Ray Inspection Machine X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. ( Offline X - Ray series ) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm
전자와 전자 제품을 위한 HD BGA 엑스레이 검사 기계
BGA X-Ray Inspection Machine for Electronic and electrical components Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray Leakage
SMD 케이블 전자공학 엑스레이 기계, Unicomp 엑스레이 발견자 AX8300 1500kg
SMD Cable Electronics Components Unicomp X-ray Detector AX8300 Model AX8300 Max kV/type 110 kV(Option90 kV)/Sealed Max.Electron beam power 25W(Option8W) Focal spot size1 7μm System magnification Up to 1000X Imaging system(Option) Flat Panel Detector Manipulator 8-axis with tilt 50 degree Measuring volume Max load area 300x300mm2 Max.sample weight 5kg Monitors 22" LCD Cabinet dimensions 1100x1100x1650mm Weight 1700kg Radiation safety2
NDT X- 선 기계
Quality NDT X ray machine Unicomp UNC225 with ASTM standard EN12543 for shock absorber defect testing Features: X-Ray shielded cabinet complies with the strictest international regulations for fully shielded radiation devices. The cabinet is completely self-contained. Manufactured in steel with complete lead shielding. Equipped with X-Ray sources from 160kV or Micro – focus sources up to 150kV . Equipped with Digital Flat Panel Detector (different sizes and resolution
큰 표본 테이블을 가진 BGA 엑스레이 검사 기계 고속을 납땜하는 PCBA
Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
내부 결점 탐지를 위한 반도체 SMT Bga 엑스레이 검열제도
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 7µm closed X-ray tube, high speed &
자동차 측정과 일치하는 세미콘 리드프레임 품질을 위한 2.5D 110 킬로볼트 X- 선 기계 유니컴프 AX8500
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
파인포퀴스는 PCBA 점검을 위해 100KV X- 선 스캐너 AX8200을 관을 답니다
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. Technical Data
휴대폰 PCBA를 위한 0.8kW BGA 무효 측정 X- 선 기계
X-Ray Inspection Machine Electronics BGA Standard Multifunction Technical Data System SummaryFootprint1080(W)×1180(D)×1730(H)mmMachine Weight1050 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size146(W)×128(D)×196(H)cmPacking Weight1160 kgPower Consumption1.0 kWX-Ray TubeTube TypeSealedMax. Power8WVoltage0~90kV (Adjustable)Focus Spot Size5μmImaging SystemDetectorFlat Panel Detector (option 4’’ i.i. Detector)Pixel Size85μmEffective Detection Area130*130mmFrame Rates20fpsPi
