전자공학 엑스레이 기계
고정밀 IC AX8300 Unicomp 5μm 마이크로 초점 110kV 밀봉 튜브 엑스레이 기계
High Precision IC AX8300 Unicomp 5μm Micro Focus 110kV Sealed Tube X-ray Machine The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration
Unicomp AX8300 고정밀 엑스레이 검사 기계 110kV는 IC용 5μm 마이크로 초점 튜브를 밀봉했습니다
Unicomp AX8300 High Precision X-ray Inspection Machine The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV equipment and
110kV 밀봉된 관 5μm 마이크로 초점 엑스레이 장비 고정밀 AX8300 Unicomp
110kV Sealed Tube 5μm Micro Focus X-ray Equipment High Precision AX8300 Unicomp The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of
360도 회전 테이블을 갖춘 고사양 전자 기판 2D 2.5D 엑스레이 기계 Unicomp AX9100MAX
High Specifications Electronic Boards 2D 2.5D X-ray Machine Unicomp AX9100MAX 130KV micron focus spot size tube X-ray machine Unicomp AX9100 with dual computers for PCB BGA inspection. Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages Fuses, power diodes, multilayer
130KV 미크론 초점 점 크기의 튜브 X선 기계 UNICOMP AX9100MAX PCB BGA 검사용 듀얼 컴퓨터
Unicomp AX9100MAX X-Ray Inspection System 130KV micron focus spot size tube X-ray machine with dual computers for high-precision PCB and BGA inspection. Optimized for non-destructive testing of semiconductors and electronics, providing comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules,
BGA 공극 측정을 위한 SMT PCB 엑스레이 기계 고해상도 미크론 초점 점 크기 Unicomp AX9100MAX
SMT PCB X-ray Machine - Unicomp AX9100MAX High-resolution micron focus spot size X-ray system optimized for BGA voids measurement and comprehensive non-destructive testing of semiconductors and electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors, wiring harnesses, and photovoltaic components. System Specifications Footprint1450
IC 곡률 측정을 위한 CNC 프로그래밍 가능 자동 검사 전자 X선 기계 Unicomp AX9100MAX
CNC Programmable Automatic Inspection Electronics X-ray Machine Unicomp AX9100MAX Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors,
고 확대 PCB X-선 기계 Unicomp AX9100MAX 전자 IC 구성 요소 접착 유선 검사
High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery
회전 감지 정밀 기하학적 배율 칩 생산 X선 UNICOMP AX9100 LED
UNICOMP AX9100 X-ray Inspection System Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100 IC Inspection System Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with navigation mode detection 7 axis linkage with 70 degree tilt detection capability