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bga x ray inspection system

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품질 BGA 및 PCBA 결함 감지를 위한 고정밀 2.5D/3D X-Ray 검사 UNICOMP AX8300 공장

BGA 및 PCBA 결함 감지를 위한 고정밀 2.5D/3D X-Ray 검사 UNICOMP AX8300

High-Precision 2.5D/3D X-ray Inspection for BGA & PCBA Defect Detection UNICOMP AX8300 The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect “In ...

품질 전자 부품 BGA 엑스레이 검사 기계 공장

전자 부품 BGA 엑스레이 검사 기계

Online inspection system for Checking LED Semiconductor Electronic Components The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more ...

품질 반도체 BGA 플립 칩 검사 X-ray AX8300 UNICOMP 지문 액세스 제어 공장

반도체 BGA 플립 칩 검사 X-ray AX8300 UNICOMP 지문 액세스 제어

Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...

품질 엑스트라 라지 검사 지역을 가진 어미판 Bga 엑스레이 검열제도 공장

엑스트라 라지 검사 지역을 가진 어미판 Bga 엑스레이 검열제도

Extra large inspection area and plenty of power PCB X RAY Machine for BGA The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, ...

품질 독립형 무효 BGA 엑스레이 검사기 DXI 이미지 처리 시스템 65W 공장

독립형 무효 BGA 엑스레이 검사기 DXI 이미지 처리 시스템 65W

Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Features X-ray tube & detector automatic lifting and ...

품질 반도체 BGA 플립칩 검사 엑스레이 AX8300MAX UNICOMP 5μm 최소 해상도 공장

반도체 BGA 플립칩 검사 엑스레이 AX8300MAX UNICOMP 5μm 최소 해상도

Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...

품질 큰 표본 테이블을 가진 BGA 엑스레이 검사 기계 고속을 납땜하는 PCBA 공장

큰 표본 테이블을 가진 BGA 엑스레이 검사 기계 고속을 납땜하는 PCBA

Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area 645*670mm, max. inspection area ...

품질 내부 결점 탐지를 위한 반도체 SMT Bga 엑스레이 검열제도 공장

내부 결점 탐지를 위한 반도체 SMT Bga 엑스레이 검열제도

Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and ...

품질 BGA 공허/납땜을 위한 100kV PCBA 엑스레이 검열제도 Unicomp 전자공학 공장

BGA 공허/납땜을 위한 100kV PCBA 엑스레이 검열제도 Unicomp 전자공학

Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification ...

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